Sinopack provides glass hermetic feedthroughs and connectors based on its glass-to-metal sealing technology. These glass hermetic feedthroughs are used for a diverse range of applications from industrial manufacturing machinery such as semiconductor manufacturing equipment to scientific and technological equipment.

Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages. The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains  such as optical communication module package, power laser package, microwave device package, high-  density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products